Navigating Three Decades of IC Materials and Failure Analysis: What I Learned
This talk reflects on my journey in the IC industry, emphasizing persistence, curiosity, openness, and authenticity. After completing a PhD in Chemical Engineering with a focus unrelated to IC processing, I began teaching Materials Science at San Jose State University. An unexpected opportunity led me to Philips Semiconductors, where I helped launch a commercial materials analysis lab. Our team was later acquired by Accurel, and in 2000, I joined TSMC in Taiwan. Over 18 years at TSMC, I led the failure and materials analysis group through major technological transitions, including the shift to Cu metallization, high-k dielectrics, metal gates, and FinFET technology. My career, marked by both successes and challenges, taught me that hard work, technical expertise, and empathy can lead to a fulfilling career in a demanding industry.
Speaker Bio:
David Su served as Director of the Failure Analysis Division at TSMC from 2000 to 2018, overseeing reliability-related failure analysis, materials and surface analysis, and chemical analysis. He is now an adjunct professor at National Tsing-Hua University and an independent consultant. Previously, he was Director of TEM and FIB Technology Development at Accurel Systems and a TEM Specialist at Philips Semiconductors. David holds a B.S. in Chemical Engineering from the University of Sao Paulo and an M.S. and Ph.D. in Chemical Engineering from Stanford University. He has served on the boards of the Taiwan Microscopy Society and the Electronic Device and Failure Analysis Society and held leadership roles in several international technical programs.