The Semiconductor Industry has made extraordinary progress in the past few decades with lateral scaling now superceded by new transistor architectures exploiting the 3rd dimension. As we approach atomic-scale dimensions, major innovations such as Gate-All-Around architectures are enabling further performance and scaling progress. This talk, Dr. Crabbe will review the industry progression from planar to FinFETs to NanoSheets transistors with their respective benefits and implications for Failure Analysis.
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