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Failure Analysis Procedures 

11-26-2024 14:57

The EDFAS Education Subcommittee strives for the development and delivery of educational products to the EDFAS membership. Keeping with its strategic focus on reaching a broader audience, including facilitating Q&A and educational exchanges on the ASM Connect platform, the Subcommittee presents short format presentations on selected FA topics. These presentations are available on ASM Connect and highlighted in EDFA Magazine.

We present the tutorial:

Failure Analysis Procedures

By Christopher L. Henderson, Semitracks, Inc.

Failure Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller, and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like design, testing, technology, processing, materials science, chemistry, and even optics! By focusing on a "Do It Right the First Time" approach to the analysis, you will learn the appropriate methodology to successfully locate defects, characterize them, and determine the root cause of failure. In this tutorial, you will learn to recognize correct philosophical principles that lead to a successful analysis. This includes concepts like destructive vs. non-destructive techniques, fast techniques vs. brute force techniques, and correct verification.

Chris is one of the founders and President of Semitracks, Inc., which provides training for the semiconductor industry, its customers, and its supply chain. In addition to managing the company, he regularly teaches courses on semiconductor technology and manufacturing, product engineering, reliability, and failure analysis.

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