WEBINAR: Democratizing Advanced FIB-SEM Workflows: AI-Driven TEM Sample Preparation and Cross Sectio

When:  Sep 25, 2025 from 13:00 to 14:00 (ET)

TITLE: Democratizing Advanced FIB-SEM Workflows: AI-Driven TEM Sample Preparation and Cross Sectioning

SPONSOR: TESCAN
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DATE/TIME: Thursday, September 25 – 7 am eastern and 1 pm eastern

DESCRIPTION: Development of advanced automation routines on modern (Plasma) FIB-SEM platforms is accelerating, driven by the integration of machine learning techniques and locally trained AI models. These innovations increase microscope utilization by enabling users without extensive FIB-SEM experience to perform complex analyses—such as inverted TEM specimen preparation or multiple side cross-sectioning—tasks that previously required months of operational training. Additionally, automation supports unattended operation outside regular working hours, significantly boosting sample throughput during nights and weekends.

This democratization of FIB-SEM workflows allows more operators to contribute to sample preparation, thereby increasing throughput and reducing cost per sample.

 

In this session, we will present the latest TESCAN automation solutions for fully automated TEM sample preparation (TEM AutoPrep™ Pro), now including automated inverted and plan-view TEM lamella geometries, as well as the newly released automated FIB cross-sectioning module—AutoSection™. AutoSection™ offers key features such as automated laser-FIB holder calibration, automated rocking polishing, automated SEM imaging, and automated polishing termination based on user-defined widths or areas.

These new capabilities streamline advanced FIB processes, expand operator accessibility, and further enhance efficiency and productivity in Gallium and Plasma FIB sample preparation.

SPEAKER: Lukáš Hladík, Product Marketing Manager for FIB-SEM, TESCAN Group (picture attached)

Lukáš Hladík is a Product Marketing Manager for FIB-SEM, characterization, and delayering/probing solutions for FA semiconductor R&D labs. He joined TESCAN GROUP, a.s. in 2012 as an application specialist for Plasma FIB-SEM platforms. All his work in TG has been connected extensively with the worldwide semiconductor industry. Lukas has a Master’s degree in Physical Engineering and Nanotechnology from Brno University of Technology, Brno, Czech Republic.