PLEASE NOTE: THIS SESSION WILL BE OFFERED TWICE. The first session is timed to be convenient for those in Europe and Asia, while the second session is aimed for those in North and South America. PLEASE BE SURE TO SELECT THE CORRECT TIME WHEN REGISTERING. The material covered will be the same in both sessions, with live Q&A to follow in each.
For years, lasers were dismissed as rough micromachining tools—fast but messy—leaving surfaces that required heavy post-processing and limiting their role in advanced semiconductor workflows.
FemtoChisel™ changes the paradigm.
Powered by TESCAN’s proprietary technology, FemtoChisel combines true femtosecond precision machining with multi-wavelength selectivity, Intelligent Multi-Gas Processing, multi-modal correlative machine vision, advanced laser energy modulation in time and space, and in situ ablation monitoring. The result is pristine, analysis-ready cross-sections delivered at high throughput—without the debris, redeposition, or heat-affected zones traditionally associated with laser processing.
In this webinar, we will explore the unique capabilities that position FemtoChisel as a breakthrough platform for next-generation microelectronics inspection and advanced materials processing. Through real-world examples, we will demonstrate how FemtoChisel enhances and accelerates previously challenging workflows.
Applications to be discussed include large-area cross-sectioning, advanced sample preparation, internal device targeted access, micro- and nanofabrication, and intelligent delayering of complex heterogeneous material stacks.