EDFAS FA Technology Roadmap

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  • 1.  Welcome

    Posted 07-19-2021 11:39
    Welcome to the EDFAS FA Technology Roadmap portal.  We are excited to have you join us!

    Both the ASM and ISTFA Organizing Committees have confirmed the introduction of an FA Technology Roadmap. The purpose of the Roadmap is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and rolled out across the industry in an interactive and inclusive manner will not only return a critical compilation of relevant action items it will also serve as a recognized technical platform from which future events can benefit. We hope this Roadmap will add value to everyone connected to the industry and we encourage you all to engage, learn, interact, and prepare for the future.

    FA DESK REFERENCE

    An assessment of the current state-of-practice for advanced failure analysis tools and techniques:

    Please find below a link to the EDFAS Microelectronics Desk Reference (7th Edition). Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.

    EDFAS Microelectronics Desk Reference


    FA CHALLENGES & SOLUTIONS

    An industry-driven technical gap analysis:

    The links below offer access to: 

    1) Top 5 Technical Challenges
    These challenges, ranked in terms of criticality, were compiled by subject matter experts currently serving as abstract review members for the associated ISTFA 2020 sessions

    2) Vendor Feedback 
    Leading vendors in the below categories were asked to provided feedback to these technical challenges. We would like to thank all the vendors who participated in this process and encourage them to continue to do so.

    Simplified Technical/Categories can be located in the LIBRARY.

    FA FUTURE

    A traditional technology roadmap:

    In order to anticipate and prepare for future FA needs, our Roadmap Committee members have been reviewing public-domain roadmaps from respected industrial and academic organizations. This work has lead to the creation of technical summaries (white papers) which we hope highlight the key learnings from this exciting material. Links to the reviewed literature are also offered for additional reading. 

    FA Future - White Papers


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    Keith Serrels
    Principal Failure Analysis Engineer
    NXP Semiconductors
    Austin TX
    (512) 895-7090
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