The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional Scanning Transmission Electron Microscopy: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; TEM Samples with PFIB and STEM EBIC; and more.
View the Digital Edition
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Nicole Hale
Director, Membership & Affiliates
ASM International
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