EDFAS Online Community

Join us on June 23, at 12:00 p.m. EDT, for an insightful overview of 3D packaging architecture, assembly process design, technology development challenges, reliability concerns, and failure analysis techniques. This talk will review the fundamentals of TSV processing, thermal compression bonding of micro bumps, process materials, direct Cu to Cu bonding, substrate materials and the manufacture process in 3D packaging and discuss in some detail the quality, reliability, fault isolation, and failure analysis of advanced 3D packages.

Throughout the discussion Dr. Li will share her career development path and how the advice of her mentors helped guide her down her path. She now motivates the engineers around her to achieve their career goals. Dr. Li encourages you to follow your passion, step out of your comfort zone, set challenging progressive goals, deliver results, and have fun.

Dr. Li has been actively involved in numerous advanced packaging related technical solutions. Her focus was on the quality and reliability, fundamental understanding of failure modes and mechanisms of electronic packages, as well as developing new tools and techniques for fault isolation and failure analysis of advanced electronic packages.

Dr. Li has been an active member of Minerals Metals and Materials Society (TMS), Institute of Electrical and Electronics Engineers (IEEE), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDFAS). She has been appointed as TMS and International Symposium for Testing and Failure Analysis (ISTFA) annual conference organizer since 2011, and EDFAS board member since 2019.

She was granted the TMS EMPMD Young Leader Professional Development Award in 2014. Dr. Li has published over 20 papers and two patents in the microelectronic packaging area. She is the co-editor of three semiconductor industry highly recognized books on 3D Microelectronic Packaging and Autonomous Vehicles.

Join us on June 23, at 12:00 p.m. EDT, for an insightful overview of 3D packaging architecture, assembly process design, technology development challenges, reliability concerns, and failure analysis techniques. This talk will review the fundamentals of TSV processing, thermal compression bonding of micro bumps, process materials, direct Cu to Cu bonding, substrate materials and the manufacture process in 3D packaging and discuss in some detail the quality, reliability, fault isolation, and failure analysis of advanced 3D packages.

Throughout the discussion Dr. Li will share her career development path and how the advice of her mentors helped guide her down her path. She now motivates the engineers around her to achieve their career goals. Dr. Li encourages you to follow your passion, step out of your comfort zone, set challenging progressive goals, deliver results, and have fun.

Dr. Li has been actively involved in numerous advanced packaging related technical solutions. Her focus was on the quality and reliability, fundamental understanding of failure modes and mechanisms of electronic packages, as well as developing new tools and techniques for fault isolation and failure analysis of advanced electronic packages.

Dr. Li has been an active member of Minerals Metals and Materials Society (TMS), Institute of Electrical and Electronics Engineers (IEEE), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDFAS). She has been appointed as TMS and International Symposium for Testing and Failure Analysis (ISTFA) annual conference organizer since 2011, and EDFAS board member since 2019.

She was granted the TMS EMPMD Young Leader Professional Development Award in 2014. Dr. Li has published over 20 papers and two patents in the microelectronic packaging area. She is the co-editor of three semiconductor industry highly recognized books on 3D Microelectronic Packaging and Autonomous Vehicles.