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Preparation of Micro Targets for Microelectronics and Other Materials Systems - Free Webinar

  • 1.  Preparation of Micro Targets for Microelectronics and Other Materials Systems - Free Webinar

    Posted 03-25-2021 15:02

    Sponsored by: Leica Microsystems

    Date and Time: Tuesday, April 6th 12PM EDT


    REGISTER HERE 

    Title: Preparation of Micro Targets for Microelectronics and Other Materials Systems

    Speaker: Andrew Lawson, Advanced Workflow Specialist, Leica Microsystems

    Event Description:

    Preparation of micro targets within microelectronics and other materials systems presents a significant challenge, as these targets are rarely visible. This causes the pinpointing and alignment of these targets to be difficult. Preparing exactly to the target is often a very-time consuming process and the targets can very easily be missed. In addition, specimens with micro targets tend to be small and difficult to handle.

    Leica Microsystems has developed tools that facilitate easy preparation of micro targets. The EM TXP offers precise in situ mechanical preparation, which uses an integrated viewing system, allowing for viewing of the prepared surface at all stages of the process. Combining this process with the EM TIC3X broad ion beam milling system allows for targets to be prepared to an excellent quality finish for high resolution electron microscopy analysis.

    In this webinar, attendees will learn:

    • How micro targets can be prepared mechanically using the Leica EM TXP target surfacing system, including a live demonstration on a real sample
    • How pristine surfaces can be prepared though broad ion beam milling in the Leica EM TIC3X
    • How to more efficiently pre-prepare samples to reduce the necessary ion milling time through the synergy of the TXP-TIC3X workflow

    Speaker(s) Bio:

    Andrew Lawson joined Leica Microsystems in 2016 and serves as an advanced workflow specialist, helping customers solve their applications problems for EM sample preparation. With a background in materials science and engineering, Andrew specializes in imaging and elemental analysis applications for materials science, semiconductor, and polymeric materials research. Prior to joining Leica, Andrew completed an M.S. degree in materials science and engineering at the University of Maryland where he focused on nanofabrication, imaging, and characterization of plasmonic materials.



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    Carrie Hawk
    ASM International
    Community Engagement Specialist

    440-338-5497
    carrieh@asminternational.org
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