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    Posted 07-19-2024 13:09

    Webinar - Advanced Materials for Improved Thermal Management and Hermetic Sealing Techniques in Semiconductor, Computing, and AI

    Date/Time: July 23, 2024 at 11:00 AM Eastern

    Description:

    Evolving semiconductor technologies are driven by the need to support new applications in computing, such as AI. To enable these uses, power density requirements are increasing rapidly, making thermal management a critical factor in package design. In addition to excellent thermal management, semiconductor materials should also be highly efficient, light weight, enable longer field life cycles and offer the ability to operate across all climate conditions. Additionally, high-level hermeticity is important to protect the semiconductor chips, ensuring they operate efficiently and securely, especially in high-reliability applications.

    In this webinar, attendees will learn about:

    • Which advanced materials are excellent for use in thermal management of electronic packages.
    • Lightweight, high-stiffness materials that can improve the positional accuracy of equipment used in semiconductor front-end processing.
    • How to use the right materials in thermal spreaders that can be bundled with several other components to achieve an efficient and miniature packaging size - crucial to enabling future computing and AI.
    • Designing hermetic packaging by combining various materials such as metal, solder and braze alloys, optical windows and ceramics.

    Speakers:

    Mike Gedeon is the manager of Materion's Customer Technical Services Department for the Performance Materials division. He has spent the bulk of his 20+ year career at Materion helping customers determine the optimum material selection for their applications.

    Ramesh Kothandapani is the Technical and Business Development Director for Materion's Microelectronic Packaging product line. He has devoted a significant portion of his career to supporting customers and optimizing their applications. Since joining Materion in 1998, Ramesh has filled a variety of roles.



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    Nicole Hale
    Director, Membership & Affiliates
    ASM International
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    IMAT Conference & Expo