Materialographic Preparation and Evaluation of Microelectronic Devices
November 14, 2 – 3 pm EST
Sponsor: Struers
REGISTER HERE
Speaker: Kelsey Torboli, Senior Application Engineer, Struers
Description: Microelectronic components present a unique challenge for materialographic preparation. In microelectronic components, various materials with widely differing properties are packaged together (glass, ceramics, metals, and polymers), so preparing all materials well can be difficult. Additional complications arise from the small size, complex geometry, and need for controlled material removal to reach a plane of interest. Please join us as we discuss Struers’ solutions for preparing microelectronic devices.
In this webinar attendees will learn about:
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Challenging clamping of complex and small samples
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Vacuum impregnation to fill vias with epoxy resin
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Controlled material removal to reach a plane of interest
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Excellent scratch-free preparation of materials with varying properties
Presenter: Kelsey Torboli, Senior Application Engineer, Struers
Kelsey Torboli is a graduate of The Ohio State University, with a B.S. in materials science and engineering. Previously a metallurgist with the ESM Group Inc., she is currently an applications engineer with Struers LLC, and is a member of the ASM Cleveland Chapter as well as the ASM IDEA Committee. When she’s not working in the lab or assisting customers, Kelsey enjoys Orangetheory Fitness and running in the Cuyahoga Valley National Park.
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Carrie Hawk
ASM International
Community Engagement Specialist
440-338-5497
carrieh@asminternational.org------------------------------