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Hello EDFAS, Over the past few years, my colleagues have used XRF as a first-cut method to assess lead finish composition on packaged devices. Doing this frees up our SEM/EDS for more intensive investigations. This made me want to examine the universe of XRF tools in more detail. So I'd like to pose ...

​ System on Package User Group Thursday, January 28 11:30 a.m. - 1:30 p.m. EST Moderators Prasad Divekar, Intel Kevin Distelhurst, GLOBALFOUNDRIES Link Here System-on-package (SoP) addresses the demand for complexity and performance by integrating components from different ...

​ Contactless Probing and Nanoprobing User Group Wednesday, January 27 11:30 a.m. - 1:30 p.m. EST Moderators Dan Bockelman, Intel Daminda Dahanayaka, GLOBALFOUNDRIES Neel Leslie, Thermo Fisher Scientific Sara Ostrowski, EAG Labs View it here The Contactless Probing ...

​ Sample Prep User Group 11:30 a.m. - 1:30 p.m. EST Moderators Jim Colvin, FA Instruments Bryan Tracy, Tesla Presentation Link HERE Sample preparation plays a critical enabling role in failure analysis within the semiconductor industry. It has become imperative for ...

​ FIB User Group Monday, January 25 Moderators Steven Herschbein, Independent Contractor Michael Wong, Thermo Fisher Scientific Valerie Brogden, University of Oregon Presentation link here Modern FIB tools are utilized in a wide variety of ...